'Van Gogh' is the codename given to the Zen 2/RDNA 2 APU at the heart of the Steam Deck. The eagle-eyed among you will notice ...

Should you buy a used graphics card? Cryptomining is largely dead, but AI-induced shortages have caused GPU prices to shoot ...

Concerns about AI's energy use have a lot of people looking into ways to cut down on its power requirements. Many of these ...

Artificial intelligence (AI) continues to shape your daily life, from online shopping to medical research. Yet behind every ...

On April 1, 2025, the Taiwanese manufacturer TSMC introduced the world’s most advanced microchip: the 2 nanometre (2nm) chip. Mass production is expected for the second half of the year, and TSMC ...

Advanced Micro Devices experienced a 7% decline over the past month. Despite announcing their 5th Gen AMD EPYC processors to power Oracle Cloud, and expanding their x86 embedded processor ...

Trump's tariffs on foreign chipmaking equipment are set to raise costs for U.S. semiconductor manufacturers, threatening to disrupt investment plans and increase the cost of domestically produced ...

It can only add single bits at a time and is limited to kilohertz clock speeds, but it is capable of executing the full RISC-V 32-bit instruction set thanks to nearly 6,000 individual transistors.

This movement followed recent announcements, including the launch of the 5th Gen AMD EPYC™ Embedded processors, which could signify a strengthening of its market position in embedded systems.

Commonly used processors generally provide various types of simulation models to designers to handle verification of the embedded processor with the related system and to find any erroneous cases in ...

The scientists said that the new transistor could be integrated into chips that could one day perform up to 40% faster than the best existing silicon processors made by U.S. companies like Intel.

HBM—essentially a 3D structure of vertically stacked DRAM dies on top of a logic die—relies on advanced packaging technologies like through silicon vias (TSVs) while using a silicon interposer for ...