The European Union and Japan formalized their quantum technology partnership on Tuesday in Tokyo, with EU executive vice-president Henna Virkkunen and Japanese minister Minoru Kiuchi signing a letter ...

TNO and imec already collaborate within the Holst Centre, also located at the High Tech Campus Eindhoven; the Photonics Lab builds on this collaboration.

Electronic design firm Synopsys announced Wednesday it has expanded its strategic partnership with TSMC, enabling optimized design work on its latest A16 and N2P processes. A16 is TSMC’s latest ...

CAMPBELL, Calif., May 13, 2025 -- Arteris, Inc. (Nasdaq: AIP), a leading provider of system IP which accelerates system-on-chip (SoC) creation, today announced financial results for the first quarter ...

With the chiplet architecture gaining momentum as a modular and scalable alternative to traditional monolithic SoCs, Secafy is leveraging Menta's eFPGA IP to add post-silicon flexibility, ...

SMIC has had trouble with yields and output which will reduce this quarter's revenues by 6%, reports DigiTimes. The problems ...

Expands memory chipset offering to cover all JEDEC defined memory modules for servers and PCs ...

Plano, Texas, USA – May 13 2025 – Siemens Digital Industries Software today announced the Questa™ One smart verification software portfolio, combining connectivity, a data driven approach and ...

Baya Systems, a leader in high-performance semiconductor system technologies, today announced its new NeuraScale™ switch fabric technology designed to overcome critical scaling and data movement ...

Our logiRECORDER Director, Jura Ivanovic presents our high bandwidth data logging demo, showing you how the XYLON QUATTRO solves the most advanced requirements of today’s automotive industry.

CELUS, the developer of an AI-assisted electronics design platform, has announced the integration of its CELUS Design Platform with the Cadence OrCAD X Platform, a comprehensive PCB design software ...

TSMC's new A14 process is already backed by certified EDA tools from Cadence, Synopsys, and Siemens to accelerate next-gen AI and chiplet-based designs.